Click on each item below to learn more about the equipment used in our state-of-the-art facility.

The SMT assembly process starts with stencil printing solder paste on the printed circuit board. The stencil design is generated by the engineer that creates the board layout and is a part of the Gerber file package that goes to your EMS partner.  ACC orders the stencil to fit our stencil printers and specifies the proper screen thickness and aperture reduction to provide quality solder joints

During the printing process, the screen must be precisely aligned with the printed circuit board. Our stencil printers have vision correction to ensure proper registration.  Poor stencil printing can result in solder bridges and no solders. This is a critical step in a quality SMT process.

ACC's SMT Lines can be used interchangeably for most projects.  All placement machines have vision systems that align the machine to the printed circuit board and inspect components prior to placement.  Here is our lineup.

Panasonic NM-EJM1C machine places all types of SMT components and even some Through-Hole components.  This machine is rated at 14,000 component placements per hour.

Fuji CP-4 "Chip Shooter" is used to place SMT resistors, capacitors and "course-pitch" components.  It is rated at 16,000 placements per hour.

Mimot Advantage places fine-pitch SMT components, BGA's, etc.  Rated at 8,500 component placements per hour, it does a great job of placing critical components.

Our SMT lines use identical Heller reflow ovens.  These are 12-zone (12 top & 12 bottom) ovens that provide the precise temperature control required for SMT soldering especially BGA's and LGA's.  The ovens are programmed with a custom temperature profile for each board that we build.

Click here to view an example of a complete MOLE Temperature Profile.

ACC has two wave soldering machines.  Our Qualitek (JT) machine is used exclusively with Lead-Free solder, and our Electrovert machine is used only with Tin-Lead solder.  Both machines are equipped with SonoFlux spray fluxers, preheaters, and chip waves for soldering SMT components mounted on the bottom side of the printed circuit boards.

Our ACE Selective Soldering machine is used to solder connectors and other through-hole components on boards that cannot be wave soldered using traditional methods.  A custom program is developed to selectively solder only specified components.  Steps:  Spray flux, Start mini-wave, Solder.

ACC's WestKleen aqueous cleaning system is used to wash boards soldered with water-soluble flux.  The water we use for cleaning printed circuit boards is first filtered by a Reverse Osmosis System and then goes through a Deionizing Process.  This super-clean water is then heated in a stainless steel water heater prior to entering the "water washing system".

ACC also offers solder with No-Clean Flux for boards utilizing components that cannot be washed.


ACC's YesTech Automated Optical Inspection (AOI) system is used to visually inspect printed circuit boards.  The system photographs a tested and approved board and then compares subsequent boards to the "golden" board.

ACC uses a Glenbrook X-ray inspection system to inspect BGA's for proper soldering.

Functional testing powers up the product and assures that it is operating properly and providing all the functions specified by the design engineer.  In most cases, our functional testers are designed and built by the original design engineer.  ACC can also have functional testers designed and built to meet customer requirements.

In-circuit testing (ICT) checks printed circuit boards for shorts and opens, checks the tolerance of components, verifies polarity of polarized components, and assures that the board has been assembled as specified by the design engineer.  Custom test fixtures and test programs are required.  Due to the "front-end" investment, in-circuit testing is often chosen for high-value or high-volume boards and assemblies that are used in life-threatening applications.

Our Nordson conformal coating system is custom programmed to cover your printed circuit assembly with a silicon coating that protects the board and components from moisture, dirt and chemicals.